Blog

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new family of magnet-free inductive position sensor (IPS) ICs that can be fully customized for various coil designs compatible with a wide range of industrial applications such as robotics, medical and healthcare, smart buildings, home appliances and motor commutation. Built for high resolution, precision, and robust performance, the new RAA2P3226, RAA2P3200, and RAA2P4200 sensor ICs offer a cost-effective alternative to traditional magnetic and optical encoders, which can be bulky, expensive, and require frequent maintenance. Renesas also launched a web-based design tool that allows customers to easily create custom sensing elements to meet their specific system needs.

Operating on non-contact coil sensor technology, Renesas IPS products use a simple metallic target and dual-coil or single-coil configurations to detect absolute rotary, linear, or arc positions. These sensor ICs are designed to maintain stable operation even in environments with elevated temperatures (-40 to 125°C), particulate matter, moisture, mechanical vibration and electromagnetic interference. Moreover, they are immune to stray magnetic fields and require no maintenance, unlike magnetic- or optical encoder-based sensors. Their durability and low upkeep make them a reliable and cost-effective sensing solution for motor drives, actuators, valves, service robots and infrastructure applications, where reliability and long-term performance are critical.

All three products offer high precision in detecting target positions, with accuracy better than 0.1 percent of the full-scale electrical range. Two of the products, the RAA2P3226 and RAA2P3200 operate at 600K RPM (electrical) with propagation delays under 100ns, which is imperative in high-speed motor applications. The advanced RAA2P3226 supports dual-coil sensing with up to 19-bit resolution and 0.01° absolute accuracy, providing the high-precision performance required for robotic applications. The RAA2P4200 targets low-speed applications such as medical devices and power tools and the RAA2P3200 is optimized for high-speed motor commutation. All three products include automatic calibration and linearization to simplify integration and improve system-level performance.

In addition to these three products, Renesas will also introduce automotive-grade IPS, RAA2P452x and RAA2P4500, which will be available later this year. The dual-channel RAA2P452x allows customers to achieve ASIL D safety compliance when paired with Renesas MCUs. This automotive-grade solution offers a cost-effective option for low-speed body control and chassis systems without compromising quality.

Designing with inductive position sensors typically involves integrating a PCB, an IC with passive components, and a metal target mounted to the moving part. The most complex part is the external sensing element, such as the transmitter and receiver coils, which must be precisely configured to realize accuracy and customized to the system’s mechanical and environmental requirements. Renesas’ web-based Inductive Position Sensor Coil Optimizer tool tackles this challenge by automating coil layout, simulation, and tuning, significantly reducing the learning curve for developers. With this tool, engineers can also obtain accurate performance estimates and overcome manufacturing constraints by optimizing the coil layout.

“Our new web-based coil design tool is a game changer for inductive position sensing,” said Leopold Beer, Vice President of the Sensors Division at Renesas. “In the past, developers had to rely on chip suppliers for technical expertise when working with inductive position sensors. We completely removed this hurdle. This intuitive tool lets developers fully customize the sensing element and automatically fine-tunes it to achieve maximum accuracy and robustness at the system level. This dramatically lowers the barrier of entry and enables more customers, regardless of their expertise level, to confidently integrate inductive position sensing into their designs.”

Key Features of the RAA2P3226, RAA2P3200 and RAA2P4200

RAA2P3226

• Dual-coil IPS for full inductive robotic joints, logistic and industrial robots/Cobots
• Output interfaces: UART, ABI, Step-Dir, I²C
• Up to 19-bit resolution and 0.01° absolute accuracy (integrated Vernier)
• Automatic Gain Control (AGC) to compensate for air-gap variations
• 16-point linearization feature to improve the accuracy
• True-power-on position information at the start-up
• Rotary On-axis and off-axis, arc and linear implementations possible
• Industrial-grade temperature range: -40°C to 125°C
• Supply voltage: 3.0V to 5.5V

RAA2P3200

• High-speed, low-latency IPS for motor commutation, E-bikes and industrial robots/Cobots
• Output interfaces: SPI, UART, ABI, UVW or Step-Dir
• Automatic Gain Control (AGC) to compensate for air-gap variations
• 16-point linearization feature to improve the accuracy
• Rotary On-axis and off-axis, arc and linear implementations possible
• Industrial-grade temperature range: -40°C to 125°C
• Supply voltage: 3.0V to 5.5V
• Overvoltage, reverse polarity, and short-circuit protection

RAA2P4200

• Single-coil design for low-speed service robots, power tools and medical applications
• Output interfaces: Analog, PWM, I²C
• Automatic Gain Control (AGC) to compensate for air-gap variations
• 16-point linearization feature to improve the accuracy
• Rotary on-axis and off-axis, arc and linear implementations possible
• Industrial-grade temperature range: -40°C to 125°C
• Supply voltage: 3.0V to 5.5V
• Overvoltage, reverse polarity, and short-circuit protection
• Replacing the ZMID4200 device

Winning Combinations

Renesas combined the RAA2P3226 with other compatible devices to develop two winning combinations: Mini BLDC Servo and Turntable System. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

Availability

The RAA2P3226, RAA2P3200 and RAA2P4200 are available in volume production, along with evaluation kits. The automotive-grade RAA2P452x and RAA2P4500 will be in production in Q4/2025. The Inductive Position Sensor Coil Optimizer is available now and supports all Renesas IPS products. For more information, visit https://www.renesas.com/IPS.

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.

(Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.

The CR-V, which originally stood for “Comfortable Runabout Vehicle,” was developed as an innovative SUV model under the concept of the “Creative Mover^*2” series, which aimed to support people in creating more fun and enjoyable lifestyles, pioneering a new genre of “urban SUV” that offered excellent comfort and runabout capability. In the 30 years since the initial launch in Japan, in 1995, CR-V has gained and maintained popularity all around the world.

While expanding sales into more markets, CR-V continued to advance in line with the needs of the customer in each era. In July 2024, the CR-V e:FCEV was launched^*3 as the first fuel cell vehicle with plug-in charging capability by a Japanese automaker^*4. In August 2025, cumulative global unit sales of CR-V reached 15 million units. Based on total unit sales over the past ten years (2015-2024), the CR-V is the best-selling Honda automobile model, establishing itself as an important model representing the Honda SUV lineup.

In 2022, Honda launched the sixth-generation CR-V model lineup. The CR-V e:HEV, a hybrid variant featuring a comfortable cabin space and dynamic driving with the Honda two-motor hybrid system, has been well received by many customers around the world, mainly in North America and China, and is scheduled to be launched in Japan as well, in the near future. Prior to the Japan launch, the CR-V e:HEV Prototype will be exhibited in the Honda booth at the Japan Mobility Show (Press days: Oct. 29 – 30, Public days: Oct. 31 – Nov. 9, 2025).   

Including CR-V models, Honda will continue to offer a lineup with a wide variety of mobility products and services that will contribute to making life more enjoyable for more customers around the world.

In September, securities lending revenues hit $1,412 million, marking an impressive 46% year-on-year increase. All asset classes performed remarkedly well with positive year-on-year revenue growth being seen across the board.  Revenues remained strong, following on from an impressive summer period. A continuation in the strong performance in both Asia equities and Exchange Traded Products continued as the two asset classes remained the standout performers.

All equity markets performed well during the month with Americas equities average fees growing by 27% year-on-year, leading to a 61% increase in revenues.  Balances continued to reach new highs as valuations grew throughout the period with lendable surpassing $26T.  Asia equities experienced a similar trend with demand in Hong Kong and South Korea continuing to push regional returns higher.  Growth in revenues continued to stall across Taiwan as average fees declined by 13% year-on-year to 2.41%.  In Europe Sweden, Germany and the UK all topped the revenue table with double digit year-on-year revenue growth, three stand out European markets included Denmark, Turkey and Italy which showed year-on-year revenues growth of 205%, 1496% and 84% respectively.  Substantial increases in balances were also seen across all three of these countries.

Exchange Traded Products continued their impressive run as revenues continued to show strong year-on-year growth and average fees increased by 24%. This revenue growth was seen across all three regions with Asia ETFs posting 121% growth.  Average fees also increased as did balances and lendable.  Utilization topped 10%, increasing in relation to August.

Across the fixed income asset classes year-on-year revenue growth was strong across Asian government bonds (+39%) and European government bonds (+9%).  Americas government bonds posted a 5% year-on-year decline in revenues as average fees fell 8% to 18bps.  This was despite a 3% increase in balances.

Corporate bond revenues remained steady during the month, posting a more modest 1% year-on-year increase.  Average fees continued to decline but balances grew which offset any financial impact.

Reinforces HSBC’s strategic priorities and long-term investment in Hong Kong
Preserves Hang Seng’s brand, heritage, and distinct customer proposition

• The Proposal includes an offer of HK$155 for each Scheme Share, representing a 33% premium over the undisturbed 30-days average closing price of HK$116.5 per share.
• HK$106 billion privatisation offer values 100% of Hang Seng at HK$290 billion on an equity value basis.
• The Proposal represents a significant investment into the Hong Kong economy and includes a commitment to retain Hang Seng’s brand, heritage, and distinct customer proposition.
• The proposal is in line with HSBC’s strategy to increase leadership and market share in areas where it has clear competitive advantages and the greatest opportunities to grow and support its clients.
• HSBC aims to grow in Hong Kong by strengthening the banking presence of HSBC Asia Pacific and Hang Seng, focusing on their relative strengths and competitive advantages, while allowing all customers to choose where to bank.

All capitalised terms which are used in this press release but not otherwise defined herein shall have the meanings ascribed to them in the Joint Announcement dated 9 October 2025. This press release should be read in conjunction with the Joint Announcement, a copy of which is available here (opens in new window).

9 October 2025 – HSBC Holdings plc (“HSBC Group” or “HSBC”) today announced that HSBC Group, together with The Hongkong and Shanghai Banking Corporation Limited (“HSBC Asia Pacific”), a wholly owned subsidiary of HSBC, has put forward a conditional proposal to privatise Hang Seng Bank Limited (“Hang Seng”) through a scheme of arrangement (the “Proposal”). If approved, the Proposal would result in HSBC Asia Pacific acquiring all remaining shares of Hang Seng held by the minority shareholders and the withdrawal of listing of the Hang Seng shares from the Hong Kong Stock Exchange.

Providing immediate cash returns to Hang Seng minority shareholders at an attractive and significant premium

The Proposal offers a Scheme Consideration of HK$155 for each Scheme Share, representing a 33% premium over the undisturbed 30-days average closing price of HK$116.5 per share. This represents an attractive and significant premium to Hang Seng’s historical trading prices, and analyst consensus targets, and is more than Hang Seng’s highest share price in 3.5 years.

The valuation of Hang Seng implied by the Scheme Consideration is HK$290 billion, representing a 1.8x 1H25A price-to-book multiple, which is significantly higher than comparable Hong Kong peers. This offer is final and will not be increased further, underscoring HSBC’s confidence in the fairness and attractiveness of the offer.

Through this Proposal, HSBC is providing Hang Seng minority shareholders with an opportunity for immediate cash realisation, enabling them to realise the benefits from HSBC’s investment in Hang Seng without needing to wait for future dividends.

Capturing Growth Opportunities in Hong Kong

The Proposal is aligned with HSBC’s strategic priority to grow its business in Hong Kong while becoming simple and agile. Hong Kong is one of HSBC’s home markets and HSBC benefits from the proud heritage and brand strength of both HSBC Asia-Pacific and Hang Seng.

The Proposal represents a significant investment into Hong Kong, which underlines our confidence in the growth potential for both HSBC Asia-Pacific and Hang Seng. The Proposal will unlock opportunities for further investment and improvements in operational leverage.

Preserving Hang Seng’s Brand and Heritage While Unlocking Growth

HSBC recognizes the proud legacy and near-100-year history of Hang Seng and is committed to retaining Hang Seng’s separate authorization as a licensed bank under the Hong Kong Banking Ordinance with its own governance, brand, distinct customer proposition and a branch network. Hang Seng’s existing customers will continue to enjoy Hang Seng’s products and services while gaining greater access to the full breadth of HSBC’s global network and full product suite. This strategic alignment is expected to drive stronger growth by leveraging Hang Seng’s competitive strengths and HSBC’s network and products.

Proposal to be fully funded by HSBC’s own resources

HSBC Group will fund the Scheme Consideration with its own financial resources. The expected day one capital impact of the Proposal is approximately 125 basis points which would arise following the approval of the relevant resolutions by the requisite majority at each of the Hang Seng Court Meeting and the Hang Seng General Meeting.

HSBC expects to restore its CET1 ratio to its target operating range of 14.0%-14.5% through a combination of organic capital generation and not initiating any further buybacks for three quarters following the date of this announcement. A decision to recommence buybacks will be subject to HSBC’s normal buyback considerations and process on a quarterly basis. The share buyback announced on 31 July will continue in accordance with its terms. HSBC continues to target a dividend payout ratio for 2025 of 50% of earnings per ordinary share excluding material notable items and related impacts.

HSBC expects that this investment in Hang Seng will be accretive to earnings per ordinary share.

Georges Elhedery, Group CEO of HSBC, commented:

“Our offer is an exciting opportunity to grow both Hang Seng and HSBC. We will preserve Hang Seng’s brand, heritage, distinct customer proposition and a branch network, while investing to unlock new strengths in products, services, and technology to deliver more choice and innovation for customers. Our offer also represents a significant investment into Hong Kong’s economy, underscoring our confidence in this market and commitment to its future as a leading global financial centre, and as a super-connector between international markets and mainland China.

“This proposal fully meets our criteria for value-accretive investments: it aligns with our strategy, enhances growth and scale, does not distract us from organic growth, and delivers greater shareholder value than buybacks.

“Together, HSBC and Hang Seng form a well-positioned platform with two iconic banking brands working side by side to deliver lasting value for customers, employees, and shareholders.”

Further information on conditions to the Proposal is provided in Hang Seng 3.5 announcement

A Scheme Document will be dispatched to Hang Seng minority shareholders in due course, providing further information on the Proposal. The Scheme will become effective subject to the satisfaction of conditions, including Hang Seng shareholder approvals, and sanction by the High Court.

Further information is provided in the 3.5 Announcement issued by HSBC Group, HSBC Asia-Pacific and Hang Seng earlier today.

Media enquiries:

Aman Ullah
+852 3941 1120
aspmediarelations@hsbc.com.hk

Neil Fleming
+44 (0)7384792051
neil1.fleming@hsbc.com