Ming-Chi Kuo reveals TSMC’s new Supplier of Advanced Packaging Materials for Apple’s 2026 iPhone and Mac processors – patentlyapple.com

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  1. Ming-Chi Kuo reveals TSMC’s new Supplier of Advanced Packaging Materials for Apple’s 2026 iPhone and Mac processors  patentlyapple.com
  2. Forget the iPhone 17 — next year’s iPhone 18 due for huge performance boost  Tom’s Guide
  3. A20 Chips in iPhone 18 Models Again Rumored to Feature New Design  MacRumors
  4. Next year’s iPhones could get bigger than usual upgrades with A20 chip  9to5Mac

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