TSMC is set to begin mass production of its 2nm process by the end of this year, with Apple already securing more than half of the 2026 capacity for the iPhone 18 series’ A20/A20 Pro processors, MacBook Pro’s M6 chips, and the next-generation Vision Pro R2 chips. Notably, the A20 series will adopt TSMC’s “Wafer-Level Multi-Chip Module” (WMCM) packaging technology for the first time, arranging the SoC and DRAM side by side while simplifying the interposer layer. This approach is expected to significantly improve thermal efficiency and yield, while reducing material costs. [Icsmart, in Chinese]
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